The Application of Employing the Discriminant Analysis Technique to Forecast the Inspection Marking on the Integrated Circuit Product
Keywords:
Integrated Circuit (IC), Image Processing, Discriminant AnalysisAbstract
This research aims to study the process of inspecting product quality on Integrated Circuit and Packaging of Electronics factory. Since the size of integrated circuit is quite small with high quantity production, this makes it easy to have some mistakes during inspection process and launch low quality product to customers. According to these reasons, the researcher decided to develop the accurate and reliable inspection process to improve the efficiency of Vision Inspection and Packing Machine to minimize the reject rate of the mistaken inspection of Integrated circuit markings. The method of Linear Discriminant Analysis is applied to analyze the mistakes in inspection. At this Inspection and Packing Machine with image process, it is found that three light sources of this machine are the main potential predictor variables with 1) : Coaxial Ring Light, 2) : High Ring Light, and 3) : Low Ring Light and the one response variable of is the marking quality of integrated circuits in gray scale. Finally, the discriminant analysis equation is calculated to forecast the marking quality integrated circuits in Gray Scale. After this equation is applied, the calculation result shows that this equation yields the high efficiency of 92.6% after the actual implementation by setting the appropriate level of three potential predictor variables on Vision Inspection and Packing Machine: Coaxial Ring Light at 22, High Ring Light at 20 and Low Ring Light at 20 respectively with accuracy level of 96.7%, product quality yield increasing at level of 99.6% and the under reject products reducing at level of 0.6%.
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