Regression Analysis Applying for Defection Rescreening of Microelectronics Product

Authors

  • Nichanach Katemukda Industrial Engineering, Faculty of Engineering, Rajamangala University of Technology Rattanakosin

Keywords:

Regression analysis, Microelectronics, Quality

Abstract

Consumer devices, such as laptops, personal data storage, and smart phones, are currently thin, compact, and light-weight. As a result, microelectronics is widely used in consumer electronics. Thailand is home to a number of manufacturers that provide microelectronics products to the market. There are two types of electronics manufacturer: provider solutions and owner brands. The print circuit board dimension 100×200×1 millimeters is now being used in the manufacturing case study. They discovered that the product failed at the test station (Functional Test), with the bulk of the root cause being a void in the through hole that exceeded the customer's requirements. A cross section and measurement are required to check the void in the through hole. This is a destructive measurement with a long lead time, and the factory does not want to rescreen any units by using a destructive method. The goal of this study is to use regression analysis to estimate void % using X-Ray image measurement as a predictor. The research found that the regression model may be used to re-screen defective printed circuit boards (the regression coefficient is not zero at 95 percent confidence intervals, and the adjusted R-square is 88.18 percent) without destroying the part. This is a practical and time-saving method. Furthermore, the factory and the supplier both acknowledge and agree on this regression model.

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Published

2021-12-29

How to Cite

[1]
N. Katemukda, “Regression Analysis Applying for Defection Rescreening of Microelectronics Product”, Eng. & Technol. Horiz., vol. 38, no. 4, pp. 42–50, Dec. 2021.

Issue

Section

Research Articles