Effects of Mn-Doped TiO2 and in Nanoparticles on Melting Point, Printability, and Wettability of SAC305 Lead-Free Solder Paste

Authors

  • วันยุทธ สุวรรณเครือ
  • ประธาน บุรณศิริ
  • กรรณชัย กัลยาศิริ

Keywords:

Lead-free solder, Nanoparticle, Wettability, Printability

Abstract

Effects of Mn-doped TiO2 and In nanoparticles on melting point, printability, and wettability of SAC305 lead-free solder pastes on Cu substrate were investigated in this paper. The composite solders were divided into two groups. The first one was prepared by adding 0.05, 0.1, 0.5, and 1.0 wt% of Mn-doped TiO2 and the second one was included additional indium of 0.5 wt% to the first group. The melting characteristic of solder was characterized by differential scanning calorimeter (DSC). The printability was measured by the weight ratio of solder, before and after printing the solder on Cu substrate. The solder was reflowed in a reflow oven at 260 oC for 30 seconds. The wettability was investigated in the terms of spread ratio, spread factor, and contact angle. It was found that liquidus temperature and solidus temperature of nano-composite solder were lower than those of SAC305. However, the melting range of nano-composite solder was greater than that of SAC305. The wettability of solder was improved by the addition of small amount of Mn-doped TiO2 and the wettability was then decreased as the amount of Mn-doped TiO2 increased. The addition of indium decreased the wettability of composite solder. The printability of solder was decreased due to the addition of Mn-doped TiO2 and indium.

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Published

2020-06-19

How to Cite

[1]
สุวรรณเครือ ว. . ., บุรณศิริ ป. . ., and กัลยาศิริ ก. . ., “Effects of Mn-Doped TiO2 and in Nanoparticles on Melting Point, Printability, and Wettability of SAC305 Lead-Free Solder Paste ”, Eng. & Technol. Horiz., vol. 33, no. 2, pp. 64–69, Jun. 2020.

Issue

Vol. 33 No. 2 (2016): april -june

Section

Research Articles

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