Productivity Improvement of Electronics Part by Using DMAIC Technique A Case Study of Printed Circuit Board Assembly Manufacturing

Abstract

This research has an objective to improve productivity in electronics products by using DMAIC technique as Define Measure Analyze Improve and Control that has substance 3 phases. The First is to increase output follow customer’s requirement that has two significant factors with output as Part Mounting Program and Part preparation. After processes improved it can increase the output 16.5%. The Second is to solve the Connector Floating that is the highest defect which root causes as Part bending after passed the Reflow Soldering Process. After improve process it was reduced from 4.12% to 1.42%. The Last phase is to reduce cost of solder paste amount 10% by change new supplier. After test the new one found the solder height value has difference so we have to do DOE with 2^5-1 Fractional Factorial Design to screen significant factors and retest them by using General Full Factorial Design to optimize level. Conclusion is Printing speed and Print gap was significant factors with solder height at α = 0.05 and the optimize value as 75 mm. /sec. and 0 mm. respectively.