An Investigation on Influence of Mn-doped TiO2 Nano-Particles on Melting Behavior, Wettability and Intermetallic Layer of SAC305+0.5In Lead-Free Solder Paste

Authors

  • Prajak Jattakul Department of Industrial Engineering, Establishment Project Faculty of Integrated Engineering and Technology, Chanthaburi Campus, Rajamangala University of Technology Tawan-Ok
  • Teerawut Khuenkaew Department of Industrial Engineering, Establishment Project Faculty of Integrated Engineering and Technology, Chanthaburi Campus, Rajamangala University of Technology Tawan-Ok
  • Kannachai Kanlayasiri Department of Industrial Engineering, Establishment Project Faculty of Integrated Engineering and Technology, Chanthaburi Campus, Rajamangala University of Technology Tawan-Ok

Keywords:

Lead-free solder, Nanoparticles, Melting behavior, Wettability, Intermetallic compound

Abstract

This research was performed to study the influence of Mn-doped TiO2 nanoparticles on the properties of SAC305+0.5In lead-free solder. The nanoparticles was used at 0.05, 0.1, 0.5 and 1.0 wt%. Effects of these factors on alloy melting behavior, wettability of solder on the copper plate and intermetallic layer of the solder joint were studied. The specimens were made according to JIS Z3198-3: 2003 standard and heated at temperature of 260oC for 30 seconds. The nanoparticles increased the melting range and the wettability of the solder. Finally, the nanoparticles decreased the intermetallic layer thickness at the composition below 0.5 wt% but increased the intermetallic layer thickness at the composition above 0.5 wt%.

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Published

2022-06-30

Issue

Vol. 1 No. 1 (2022): The Journal of Manufacturing & Management Technology

Section

Call for Paper for The Journal of Manufacturing & Management Technology

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