Electrode and Ground Arrangement on Sample Plate Under Electrostatic Powder Coating Process
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In this research study, the electrode and ground arrangement on sample plate is studied in order to increase the electrostatic powder coating process. The electrode and ground arrangement are varied in order to improve the electric force and the thickness of coating. The first result shows the electric force is appearing under the electrostatic process, and the electrical voltage distribution is different with various the electrode and ground arrangement. For the second part, the thickness of the powder coating of the sample plate is increased with the number of the coating, and the electrostatic process can more increase the thickness of coating than without the electrostatic process. In addition, the electrode and ground arrangement are affected with the thickness of the powder coating on the sample plate. In the last part, a similar trend of the graph has appeared in the experimental and the numerical results, so the experimental results have good agreement with the experimental results.
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