Adsorption of copper and lead ions by chitosan powder and sodium tripolyphosphate-modified chitosan resin: Kinetics, mechanism and mass transfer
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Abstract
Chitosan powder (CS) and modified chitosan by sodium tripolyphosphate resin (CTP) using as adsorbents to adsorb copper and lead ions in solution were studied in the batch adsorption systems. CS and CTP showed higher selectivity towards lead ion over copper ion in the single metal system. However, it was found the adsorption capacity of copper ion for CS and CTP was 5.17 and 8.10 mg/g, respectively. The adsorption capacity of lead ion onto adsorbents was 7.23 and 8.95 mg/g, respectively. The pseudo-second order was fit to describe the kinetics of adsorption. The mechanism of the adsorption occurred in 3 steps. The rate limiting step for mechanism of adsorption was film diffusion. The external mass - transfer coefficient and intraparticle mass – transfer of CTP were higher than CS.
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