The study of factor affecting on bond pad contamination in saw process of integrated circuit (IC) packaging

Abstract

This research studied about the factor that effect to contamination on bond pad in saw process of integrated circuit (IC) packaging. Saw process is a first process in IC packaging manufacturing. The most importance of the mechanical saw process for high quality is high yield and reliability which main concerns to bond pad cleanliness. The important problem at the present in this process is bond pad contamination to reduce lot reject rate, hi experiment, tile wafer samples were cut in saw process by adjusting cleaning parameters which were washing time at 10, 60, and 120 seconds and drying time at 10, 50, and 100 seconds. The experiment studied with die size 120x120 mils. For analysis, tile wafer samples were analyzed by visual inspection microscope and energy dispersive x-ray spectroscopy (EDX) to check bond pad contamination. The results suggested that the duration of the washing time 120 seconds and drying time 100 seconds gave tile least rate of contamination. Therefore, the adjusting of sourced parameters for bond pad contamination effect to contamination of IC package.