LEI, P.; RUENGPHRATHUENGSUKA, W.; CHIPIPOP, B. Thermal Conductivity of External Wall Insulation Materials for Buildings. SAU JOURNAL OF SCIENCE & TECHNOLOGY, [S. l.], v. 10, n. 2, p. 17–27, 2024. Disponível em: https://ph01.tci-thaijo.org/index.php/saujournalst/article/view/255622. Acesso em: 21 sep. 2026.