Taniguchi, Y., H. Shimada, M. Ozaki, and K. Kodama. “Small Billet Forming of Porous Sintered Copper Sheet”. Journal of Research and Applications in Mechanical Engineering, vol. 2, no. 1, Oct. 2018, pp. 34-41, https://ph01.tci-thaijo.org/index.php/jrame/article/view/149427.