JATTAKUL, P.; KHUENKAEW, T. .; KANLAYASIRI, K. An Investigation on Influence of Mn-doped TiO2 Nano-Particles on Melting Behavior, Wettability and Intermetallic Layer of SAC305+0.5In Lead-Free Solder Paste. Journal of Manufacturing & Management Technology, [S. l.], v. 1, n. 1, p. 39–47, 2022. Disponível em: https://ph01.tci-thaijo.org/index.php/jMMT/article/view/247488. Acesso em: 10 dec. 2025.