Srisang S, Puajindanetr S. Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: a case study of electronic component factory. Eng Appl Sci Res [Internet]. 2014 Oct. 24 [cited 2024 May 15];41(3):347-55. Available from: https://ph01.tci-thaijo.org/index.php/easr/article/view/22540