Srisang, Sakulkaew, and Somchai Puajindanetr. “Reduction of Adhesive Stain Defect in Flexible Printed Circuit Board on Hot Pressing Process: A Case Study of Electronic Component Factory”. Engineering and Applied Science Research 41, no. 3 (October 24, 2014): 347–355. Accessed May 15, 2024. https://ph01.tci-thaijo.org/index.php/easr/article/view/22540.