Srisang, S., and S. Puajindanetr. “Reduction of Adhesive Stain Defect in Flexible Printed Circuit Board on Hot Pressing Process: A Case Study of Electronic Component Factory”. Engineering and Applied Science Research, vol. 41, no. 3, Oct. 2014, pp. 347-55, https://ph01.tci-thaijo.org/index.php/easr/article/view/22540.