Srisang, S. and Puajindanetr, S. (2015) “Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory”, Engineering and Applied Science Research, 42(1), pp. 61–69. Available at: https://ph01.tci-thaijo.org/index.php/easr/article/view/32586 (Accessed: 20 May 2024).