Srisang, Sakulkaew, and Somchai Puajindanetr. 2014. “Reduction of Adhesive Stain Defect in Flexible Printed Circuit Board on Hot Pressing Process: A Case Study of Electronic Component Factory”. Engineering and Applied Science Research 41 (3):347-55. https://ph01.tci-thaijo.org/index.php/easr/article/view/22540.