Application of Taguchi Method for Defect Reduce Assembly Process on Printed Circuit Board A Case Study of An Electronics Part Factory

Main Article Content

Somporn Vongpeang
Anyarat Prasanjai


          This research aimed to reduce a defect in printed circuit board assembly process. The amount of defect of the production process at a case study company was 4.39 percent before the improvement. The steps of improvement were based on the Pareto chart and cause – effect diagram to analyze the problem and design the experiment by Taguchi method in order to find the suitable factors. The effective factors in the process were a squeegee Speed, a squeegee force, and a board size height. The experiment was designed as a tool to determine the appropriate set of parameters in order to find the signal to noise ratio that had a smaller the better value.
         The result of this research showed that the appropriate parameters to set up the machine were: a squeegee speed was 30 millimeters per second, a squeegee force was 20 Newton, and a board size height was 1.0 millimeters. After the experiment, it showed that defect reduced to 2.58 percent from 4.39 percent.


Download data is not yet available.

Article Details

Research Article


[1] Panuwat Tanasanskulwong, “Application of Lean Six Sigma in Wine Glass Manufacturing Industry,” (In Thai), TNI Journal ofEngineering and Technology, Vol.7 No.1, pp. 22-31, January – June 2019.

[2] D.C. Montgomery, Design and Analysis of Experiments, 6th ed.USA.: John Wiley & Sons, 2005.

[3] G. Taguchi, Taguchi Techniques for Quality Engineering, New York: McGraw-Hill, 1988.

[4] Roy, R.K., A primer on the Taguchi competitive manufacturingSeries, New York: Van Nostrand Reinhold, 1990.

[5]Chalida Chanwichit, “Application of Taguchi method to reduce packet loss,”(In Thai), IE Network 2015 SILPAKORN UNIVERSITY, pp. 36-40, April 6-7, 2015.

[6] Srinivas Athrey,“Application Of Taguchi Method For Opti-mization Of Process Parameters In Improving The Surface Roughness Of Lathe Facing Operation,”International Refereed Journal of Engineering and Science (IRJES), Vol. 1, No. 3, pp.13-19, November 2012.

[7] Wanruedee Intananok, “DETERMINE PROPER CONDITIONS TO REDUCE DEFECTIVES IN A SOLDER PASTE SCREEN PRINTING PROCESS”, Master of Engineering thesis, Industrial Engineering Department, Chulalongkorn University, Bangkok, Thailand, 2015.

[8] Surapong Bangphan, “Application of Taguchi Method for Optimizing Turning Process by Studying of Production Machining Parameter,”(In Thai), UBU Engineering Journal, Vol.7, No.2, pp. 104-112, July-December 2014.