Application of Taguchi Method for Defect Reduce Assembly Process on Printed Circuit Board A Case Study of An Electronics Part Factory
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Abstract
This research aimed to reduce a defect in printed circuit board assembly process. The amount of defect of the production process at a case study company was 4.39 percent before the improvement. The steps of improvement were based on the Pareto chart and cause – effect diagram to analyze the problem and design the experiment by Taguchi method in order to find the suitable factors. The effective factors in the process were a squeegee Speed, a squeegee force, and a board size height. The experiment was designed as a tool to determine the appropriate set of parameters in order to find the signal to noise ratio that had a smaller the better value.
The result of this research showed that the appropriate parameters to set up the machine were: a squeegee speed was 30 millimeters per second, a squeegee force was 20 Newton, and a board size height was 1.0 millimeters. After the experiment, it showed that defect reduced to 2.58 percent from 4.39 percent.
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References
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